Basics of cooling

Due to the ever-increasing performance of components in power electronics – coupled with increasing compactness – high heat loads often arise. High temperatures negatively impact the service life of electronic components. To prevent early failure, the heat must be dissipated.

Free convection – heat dissipation via the housing surface

In natural convection, airflow occurs due to temperature differences within “hot spots.” Targeted design measures can create natural airflow.

Forced convection – heat dissipation via the housing surface

Heat dissipation is achieved through forced convection. This type of cooling is suitable for low power dissipation at medium ΔT and for avoiding hot spots. The forced airflows ensure optimal use of the housing surface for cooling.

If cooling via the enclosure surface is insufficient, we can integrate the following systems into your enclosure:

• Filter fans and fan assemblies
• Air-to-air heat exchangers
• Filter systems (LAT)
• Special solutions (air-to-water heat exchangers, air conditioning units, etc.