Electronics Cooling

Electronics Cooling


High thermal loads on components and their surroundings are occurring, due to constantly growing performance capabilities with increasing compactness. The process of complex geometrical assembly of components, installations and systems to each other makes a sheer manual-theoretical evaluation of temperature conditions difficult.

With CFD simulations we can inspect variable system parameters:

  • Flow
  • Temperature
  • Pressure
  • Consideration of Thermal Conduction, Thermal Radiation, and Convection

We offer a competent and interconnected service package — quick and reliable results as well as effective solutions.