Electronic Cooling
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Due to the ever-increasing power capacity of components in power electronics—combined with their growing compactness—components and their surroundings are often subjected to high thermal loads. The complex geometric arrangement of components, subassemblies, and systems relative to one another makes it difficult to assess temperature conditions purely through manual or theoretical means.
CFD simulations can be used to analyze variable system parameters
- Flow
- Temperature
- Pressure
- Accounting for heat conduction, thermal radiation, and convection
We offer you a comprehensive and integrated service package—reliable and quick results, as well as effective solutions.
Products
Air conditioning components and more
