PRACTICAL, EFFICIENT & INNOVATIVE
We develop, optimize, and verify climate control concepts on behalf of our clients. Where technical equipment, complex systems, and power electronics must operate safely and flawlessly, an optimally controlled heat dissipation solution is essential. Thermal simulation forms the foundation of this process. With the professional use of 3D simulation systems, we can precisely calculate the cooling requirements of a product, a specific component, or an entire system and deliver fast and reliable results.
Our primary goal is to significantly extend the lifecycles of electronic components and entire technical systems while minimizing energy consumption and reducing maintenance costs. The physics behind these processes is complex, but Delta IDL makes it visible to you by visualizing cause and effect.
Shorter Time-to-Market Through Numerical Analysis
Competitive pressure in modern industry demands increasingly shorter development cycles. A faster time-to-market is often the decisive factor in the commercial success of new products. By using Computational Fluid Dynamics (CFD) analysis, there is no longer a need to build expensive and time-consuming physical prototypes for every iteration. The advantages of numerical simulation at a glance:
- Location/climate simulation: Realistische Vorhersage der thermischen Leistung ohne realen Materialeinsatz.
- Prototype optimization: Quick identification and evaluation of critical areas (hotspots).
- Simultaneous engineering: Simple optimization through simultaneous component modification directly on the computer.
- Existing product verification: Simple and cost-effective verification of existing products and systems.
- Data-driven approach: Quick results based on standardized CAD data and models.
- Resource conservation: Significant cost and time savings in development, tooling, prototyping, material usage, and by eliminating the need for complex physical measurements.
Fundamentals of Heat Transfer: A Focus on Thermodynamics
To effectively manage heat transfer, it is necessary to understand and calculate the three fundamental mechanisms of heat transfer. Every component and every system interacts dynamically with its environment.
Heat Conduction
Heat conduction refers to the transfer of heat within solid materials or between components that are in direct contact with one another. Material properties, particularly thermal conductivity, play a decisive role in this process.
Heat Transfer by Convection
Convection is the transfer of heat through the flow of fluids, typically air or liquid coolants. We distinguish between natural (buoyancy caused by temperature-induced density differences) and forced convection (driven by fans or pumps). In many devices, forced convection is the primary method of heat dissipation.
Thermal Radiation
Every object emits thermal radiation depending on its temperature and surface properties. Especially at high absolute temperatures, in the absence of convection, or in a vacuum, radiation can account for a significant portion of the total heat transfer and must be included in the simulations.
Causes and Risks: Thermal Stresses
Temperature is not only a factor affecting electronic performance but also mechanical safety. When materials are heated, they expand. This process is defined by specific coefficients of expansion. If components made of different materials (for example, on a printed circuit board) are exposed to varying temperature gradients or significant temperature fluctuations, they expand to different degrees.
FEM Simulation for Structural Mechanical Analysis
While CFD analysis calculates flow patterns and temperatures, the finite element method (FEM simulation) can be used to determine the resulting mechanical effects on the design. If we know the temperature distribution of an object, the stress and behavior of the materials under heat can be accurately calculated. This can provide essential information for the design process, allowing weak points to be addressed early on through adapted geometries or alternative materials.
Thermal Simulation: Typical Applications
Enclosure Climate Control
Thanks to our experience and the use of 3D simulation systems, we can deliver quick results for climate control and to ensure the functionality of system integrations. This is particularly important in areas where sensitive equipment is operated in devices, enclosures, and containers, or under extreme outdoor and/or indoor conditions.
Electronic Cooling
High power dissipation places increasing demands on thermal management. CFD analysis in electronic cooling applies to virtually all aspects of component, board, enclosure, cabinet, and fan design. Only by a detailed temperature distribution analysis critical hotspots can be avoided in a timely manner.
Fan Management
Operating conditions, efficiency, and flow fields can be determined using the corresponding performance curve—with numerically precise adjustment of the actual operating point. This is helpful for the targeted selection of fan types and facilitates the adaptation or optimization of systems. Here, proper airflow management is crucial for overall performance.
Heat Sink Sizing
Using CFD for heat sink sizing allows us to analyze all relevant boundary conditions and influencing factors simultaneously, in a realistic manner, and while taking nearly all interdependencies into account. This enables us to quickly assess cooling performance even before the first prototype is manufactured from copper or aluminum.
Challenges in Today’s Thermal Management
Due to extremely high power dissipation and ever-shrinking component sizes, the demands on modern thermal management solutions are growing rapidly. Engineers regularly face the challenge of dissipating enormous heat loads in very confined spaces. Among the biggest problems are hotspots, thermal interference from adjacent heat sources, as well as inefficient airflow, recirculation, and/or air short-circuiting. Only thorough calculation and optimization can ensure long-term, trouble-free operation in these cases.
Our CFD Project Workflow: Step by Step to a Solution
To ensure the highest quality, transparency, and cost-efficiency, we follow a strictly standardized project workflow. This structured process ensures that all relevant physical boundary conditions are taken into account.
Customized Assessment of Your Project Requirements
Every thermal system is subject to specific physical conditions. We would be happy to assess the technical feasibility and requirements of your specific project through direct consultation. Please contact us to discuss your specific thermal challenges or existing CAD data with no obligation.
To provide an initial, well-founded understanding of our methodology, we have summarized the answers to the most fundamental questions regarding CFD analysis below:
FAQ: Frequently Asked Questions About Thermal Simulation
1. What exactly is a thermal simulation (CFD analysis)?
2. At what stage of development does it make sense to use simulation?
3. What data is required for a conclusive simulation?
4. What happens if I don’t have all the thermal data for my components?
5. How do computational fluid dynamics (CFD) and structural mechanics (FEM) work together?
6. How does simulation help reduce development resources?
7. Can existing, already installed systems also be optimized?
8. How long does a typical CFD project take?
Products
Air conditioning components and more

