Basics of Heat Dissipation
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Basics of Heat Dissipation
Due to the ever-increasing power capacity of components in power electronics—combined with their growing compactness – often high thermal loads result. High temperatures have a negative impact on the service life of electronic components. To prevent premature failure, the heat must be dissipated.
Natural convection – Heat dissipation via the enclosure surface
In natural convection, airflow is generated by temperature differences inside the shelter (chimney effect). This type of cooling is suitable for low power dissipation without “hot spots.” Natural airflow can be created through specific design measures.
Forced convection – heat dissipation via the enclosure surface
Heat is dissipated through forced convection using artificially generated airflows. This type of cooling is suitable for low power dissipation at moderate temperature differentials (ΔT) and for preventing hot spots. The resulting forced airflows ensure an optimal utilization of the enclosure surface for cooling.
If cooling via the enclosure surface is insufficient, we can integrate the following systems into your enclosure:
- Filter fans and fan assemblies
- Air-to-air heat exchangers
- Filter systems (LAT)
- Custom solutions (air-to-water heat exchangers, air conditioning units, etc.)
Thermal Simulation
for Greater Design and Functional Reliability
